Wafer-Level Testing and Test During Burn-In for Integrated Circuits.

Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This...

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Bibliographic Details
Main Author: Bahukudumbi, Sudarshan
Other Authors: Chakrabarty, Krishnendu
Format: Electronic eBook
Language:English
Published: Norwood : Artech House, 2010.
Subjects:
Online Access: Full text (MFA users only)
ISBN:9781596939905
1596939907
9781596939899
1596939893
Local Note:ProQuest Ebook Central